| abstract |
(Problem) In the manufacturing process of a semiconductor device, a display device, etc., it provides a cleaning liquid and a washing | cleaning method which can remove microparticle contamination with high efficiency compared with the prior art with respect to the device substrate.n n n (Solution means) A substrate surface having at least the following (A), (B), (C) and (D), wherein the pH is 9 or more and the content of (C) is 0.01% by weight or more and 4% by weight or less. It is in the cleaning liquid.n n n (A) A hydrocarbon group which may have a substituent, and an ethylene oxide addition type surfactant having a polyoxyethylene group in the same molecular structure, wherein the carbon number (m) contained in this hydrocarbon group and the number of oxyethylene groups in the polyoxyethylene group (n) And the ratio (m / n) is m / n ≦ 1.5.n n n (B) alkali componentn n n (C) hydrogen peroxiden n n (D) water |