| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4d72711e97d894c55af805c9de2053ab |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A47L2601-04 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A47L11-201
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0381
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A47L11-4086
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0382 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 |
| filingDate |
2006-03-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fda7be584c5a6af07c427bf31a3b0686
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4851e387714421b7078086c4076be866 |
| publicationDate |
2006-09-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20060099415-A |
| titleOfInvention |
Negative-type photosensitive resin composition |
| abstract |
A negative-type photosensitive resin composition is provided that can be used to form an interlayer dielectric layer on a silicon wafer or printed wiring board. This composition comprises a vinylphenol resin, a biphenyl-phenol resin and an epoxy-containing material. Also provided are methods of forming patterned dielectric films using such compositions. Resin compositions can be used, for example, in wafer-level chip-scale packages and LSI fabrication as interlayer dielectric layers.n n n none |
| priorityDate |
2005-03-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |