http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20060097786-A

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_aafe0172ffd94d3486c518b0709bb2b3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_299590fc295bf6c44ed78a57daff1170
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-044
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1463
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3212
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C01B33-023
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02024
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-30625
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14
filingDate 2005-03-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1ac40e574a18133938f401245ebb68f9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6119d3aa87a246edfa90274a1f9a0569
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a8621e8f70cf426fcef54cf7559dc218
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2c7b90b5a9717a331ab913b591928a5c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_efd4bb645fb0454bc568d90babbe779f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ba9e396e1e91646d44a43d2a50e2c0ec
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9e19a62960316ab1ebca4b3f3054ee0e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_619ba6de0fa8e7c406770253c101759b
publicationDate 2006-09-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20060097786-A
titleOfInvention Polishing slurry composition for improving the surface quality of silicon wafer and polishing method using the same
abstract BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polishing slurry composition for use in a silicon wafer polishing process, wherein an acetic acid chelating agent and a phosphate chelating agent are used for a polishing slurry composition containing an ultrapure water, a colloidal silica, a pH adjusting agent, and a water-soluble thickener. It can be prepared by adding at least one chelating agent. Storage stability is greatly improved by the present invention, and especially when used for silicon wafer final polishing, it is possible to greatly improve the haze, LPD and surface roughness of the wafer surface.n n n Polishing slurry composition, colloidal silica, water soluble thickener, acetic acid chelating agent, phosphoric acid chelating agent
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2023282475-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102358134-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100643632-B1
priorityDate 2005-03-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID10234160
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419552883
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419512635
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID16698
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID426849379
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID176
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID426156745
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419554224
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID8758
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559541
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID1004
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID451486588
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID426260397
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID3053
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID457707758
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID962
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID6379
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5461123
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419519962
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID411550722
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID3084169
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID407330845
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419513221
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID18931850
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID448979509
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID406903350
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID1061
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID411550719
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID6049
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID414864150
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID24832111
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID8112
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID24261
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419486281
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID22440005
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID8773

Total number of triples: 65.