abstract |
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polishing slurry composition for use in a silicon wafer polishing process, wherein an acetic acid chelating agent and a phosphate chelating agent are used for a polishing slurry composition containing an ultrapure water, a colloidal silica, a pH adjusting agent, and a water-soluble thickener. It can be prepared by adding at least one chelating agent. Storage stability is greatly improved by the present invention, and especially when used for silicon wafer final polishing, it is possible to greatly improve the haze, LPD and surface roughness of the wafer surface.n n n Polishing slurry composition, colloidal silica, water soluble thickener, acetic acid chelating agent, phosphoric acid chelating agent |