| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_55bc2bae9f65cfaede67b62128f00e9b |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29L2011-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-351
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C35-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29K2995-0018
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12041
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15787
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48247
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29K2021-00 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-97
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-0753
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C33-0016
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C39-006 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/F21K99-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-58
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-50 |
| filingDate |
2006-02-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_220afe10be43320643a8139255e42933 |
| publicationDate |
2006-08-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20060093662-A |
| titleOfInvention |
Method of manufacturing light emitting diode lamp and light emitting diode device |
| abstract |
Light emitting diode (“LED”) devices have an LED chip 408 attached to a substrate 406. The terminals of the LED chip are electrically coupled to the leads 412 and 414 of the LED device. An elastic encapsulant 404 in the receptacle 402 of the LED device surrounds the LED chip. The second encapsulant 408 is disposed in the opening of the receptacle on the elastic encapsulant. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101125348-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20090064472-A |
| priorityDate |
2005-02-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |