| abstract |
The present invention is directed to a composition for selectively removing residues, such as ashed photoresist and / or processing residues, and to methods comprising the compositions. In one embodiment, a composition for removing residue is provided wherein the composition has a pH in the range of about 2 to about 9 and wherein the organic acid and the counterbase of this organic acid range from 10: 1 to 1:10: Buffer solutions, fluorides, and water, including in molar ratios of bases, provided that the composition is substantially free of added organic solvents. In another embodiment, the composition may further comprise a corrosion inhibitor and / or surfactant. |