| abstract |
A semiconductor device has a wiring pattern on a board | substrate formed with the insulating film which consists of organic substance, the semiconductor chip is mounted, and is electrically connected with a liquid crystal display panel, a PW board | substrate, and an anisotropic conductive adhesive agent. The silicon coupling agent is processed on at least one surface of the insulating film. Silicon (Si) which is a constituent element of the silicon coupling agent exists in the surface of an insulating film at 0.5-12.0 atomic% (surface element concentration).n n n n Insulating film, coupling agent, liquid crystal display |