http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20060080684-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_2707056d594790a62947ee030653e6f8 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B42D3-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B42P2241-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B42P2241-02 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B42D5-006 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-02 |
| filingDate | 2005-01-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_169097dc47739e23c4ecb8e63b295a69 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_67a03e8d95d520354f0aa54caac1606b |
| publicationDate | 2006-07-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20060080684-A |
| titleOfInvention | Surface-Modified Polyimide Film, Manufacturing Method Thereof and Copper Foil Polyimide Laminate Using the Same |
| abstract | The present invention provides a surface-modified polyimide film having phosphorus or phosphorus oxide groups (P = O) introduced to the surface of the polyimide adhesive layer using plasma, which treats the surface of the polyimide adhesive layer using plasma. This improves the adhesive strength between the adhesive layer and copper, and also increases the peel strength between copper by introducing phosphorus and phosphorus oxide groups, resulting in the overall improvement of physical properties of Tape Automated Bonding (TAB) tapes or flexible printed circuit boards. Can |
| priorityDate | 2005-01-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 39.