| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1e70c0aeade92d7571d955d3b90ea06e |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2379-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0154
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0209
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31721 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0346
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-01
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0373
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-18 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-18 |
| filingDate |
2005-12-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fbdf1fd5f14cd3938e9944d7feda59cd |
| publicationDate |
2006-06-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20060067879-A |
| titleOfInvention |
Thermally conductive polyimide film composites with high thermal conductivity useful in electronic devices |
| abstract |
For electronic devices, heat removal is an important consideration for any device designer. Disclosed herein is a thermally conductive high temperature polyimide composite in which a dielectric is layered with a metal on one (or both sides), generally useful as a dielectric layer or precursor metal-laminate in an electronic device. The polyimide composites of the present invention contain thermally conductive filler particles dispersed therein from 40 to 85% by weight. This film composite has good dielectric strength, good thermal conductivity, and optionally good adhesion.n n n Electronic device, high thermal conductivity, thermally conductive polyimide film composite |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20200123918-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101339664-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101292997-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101440276-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2020218693-A1 |
| priorityDate |
2004-12-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |