http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20060052210-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fdad00677b9268c26e005a9e03a7b9dd |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15331 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-1023 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-563 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06572 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-1058 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-0652 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06517 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01322 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49816 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49833 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-0657 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 |
| filingDate | 2005-10-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c83e6422d591ce13d171f8322179e3d4 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_41a76f1dd95bcf527881fb0961a916e4 |
| publicationDate | 2006-05-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20060052210-A |
| titleOfInvention | Semiconductor device and assembly method of semiconductor device |
| abstract | A semiconductor device according to the present invention includes a base substrate, a first pinned layer on the base substrate, a first semiconductor chip on the first fixed layer, a first substrate above the first semiconductor chip, and the first semiconductor chip. A plurality of first connection members spaced apart from the first substrate and electrically connected to the first substrate and the base substrate, and a first substrate sealing resin layer around the first connection member. Moreover, according to the assembling method of the semiconductor device which concerns on this invention, the 1st fixed layer is arrange | positioned on a base substrate, the 1st board | substrate which has a 1st semiconductor chip on the lower surface on the said base substrate is opposed, and the said 1st fixed layer Fixing the first semiconductor chip thereon, and a plurality of first connection members for electrically connecting the first substrate and the base substrate between the first substrate and the base substrate, and disposing the first connection member. The 1st board | substrate sealing resin layer is arrange | positioned around.n n n n Base board, fixed layer, semiconductor chip, board | substrate, connection member, board | substrate sealing resin layer |
| priorityDate | 2004-10-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 34.