| abstract |
After depositing a soldering braze composition on a substrate on which a resin mask layer was formed using a dry film resist, which is a photosensitive resin, around the electrode, the precipitated braze composition was then heat-treated to deposit solder on the surface of the electric electrode. In removing the electric resin mask layer, at least one selected from glycol ethers and amino alcohols is used to remove the resin mask layer after heat treatment. This makes it possible to easily remove the heat-treated resin mask layer in a short time without damaging the soldering resist and solder bumps of the substrate.n n n n Soldering, Soldering Composition, Photosensitive Resin, Resin Mask Layer, Glycol Ether, Amino Alcohol |