| abstract |
In the present invention, after coating a polyamic acid varnish on an ultrathin copper foil with a carrier having a thickness of 9 μm or less, it is semi-dried, and then the polyimide film is laminated by heat roll compression, and the heat treatment of the varnish is carried out. Removing the solvent, imidating the polyamic acid, and performing a heat treatment in an atmosphere having an oxygen concentration of 2% by volume or less, and a thickness of the polyimide adhesive layer after imidating the polyamic acid is 6 μm or less, The total thickness of a mid film and a polyimide adhesive layer is 25 micrometers or less, and the manufacturing method of Tg of a polyimide adhesive layer exceeds 400 degreeC.n n n According to the method of this invention, also in manufacture of the flexible metal foil polyimide laminated board of the pure polyimide of a thin member by a lamination method, the flexible metal foil polyimide laminated board excellent in cut resistance and high temperature bendability is obtained.n n n Ultrathin copper foil, polyamic acid varnish, polyimide, laminate, soft metal foil |