http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20060049801-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_73ebc284a55d5daf0e209d6186c9e65c |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K71-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K19-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0783 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K59-125 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4069 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0221 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0289 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76802 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0126 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02F1-167 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-002 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K59-131 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3205 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-005 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02F1-1345 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-28 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G02F1-167 |
| filingDate | 2005-07-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2bbb706f49596278c890d0b08627b691 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_27554530cfdc41cb6c026680c14339a5 |
| publicationDate | 2006-05-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20060049801-A |
| titleOfInvention | Method of forming contact hole, method of manufacturing circuit board, and method of manufacturing electro-optical device |
| abstract | In the present invention, when a contact hole is formed in an interlayer film by using a needle, and a conductive material is formed by embedding a conductive material, the conductive part has reliability of conduction and prevents disconnection of the wiring by the convex part. An object of the present invention is to provide a method for forming a contact hole, a method for manufacturing a circuit board, and a method for manufacturing an electro-optical device.n n n A substrate 20, a first electrode 34b provided on the substrate 20, an interlayer film 32 provided on the first electrode 34b, and a second electrode 34 provided on the interlayer film 32. In one circuit board 10, a conductive portion 300 made of a conductive material is formed in the contact hole H of the interlayer film 32 to conduct the first electrode 34b and the second electrode 34. . First, while mechanically punching the interlayer film 32 with the needle P, the first interlayer film 32 is chemically dissolved by the solvent contained in the needle P to reach the first electrode 34b. The contact hole H is formed, and the conductive portion 300 is formed by embedding a conductive material in the contact hole H.n n n n Needle, interlayer, chemical, dissolution, contact hole |
| priorityDate | 2004-07-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 49.