| abstract |
Provided are a circuit device capable of forming a fine pattern while ensuring a current capacity and excellent in heat dissipation and a method of manufacturing the same.n n n In the circuit device 10A of the present invention, among the multilayered wiring layers, the first wiring layer 24 is formed of a thin first conductive pattern 24A and a thick second conductive pattern 24B. Therefore, formation of a fine pattern was realized while securing an electric capacity. In addition, the circuit element 14A of the small signal system is mounted on the first conductive pattern 24A, and the circuit element 14B of the large ammeter is mounted on the second conductive pattern 24B, so that the magnitude of the current to be handled is different. The device was mounted on the same substrate. In addition, heat dissipation was improved by the thick second conductive pattern 24B.n n n n Circuit device, wiring layer, conductive pattern, insulating layer, circuit board, conductive foil, resist, lead, sealing resin |