| abstract |
The present invention relates to a nanotip bonding apparatus and a bonding method, and more particularly, to a nanotip bonding apparatus and a bonding method using an electrolytic etching having excellent adhesion stability. To this end, the glass plate 5 having a plane of a predetermined area thereon; An electrolyte solution 4 placed on the glass plate 5 with surface tension and having conductivity; Transfer means capable of reciprocating the conductive base 1 in one direction; Carbon nanotubes (2) adhered to the tip of the base (1) by an adhesive (10) and whose ends are immersed in the electrolyte solution (4); And power supply means for applying power to the electrolyte solution 4 and the base 1.n n n n Carbon nanotube, electrolyte solution, nanotip, glass, conduction, adhesion, stability, base, adhesive |