| abstract |
A method and apparatus are disclosed for forming an electrically and / or thermally conducting interconnect in which a first surface and a second surface are in contact with each other via a plurality of nanostructures disposed on at least one of the surfaces. In one embodiment, the first plurality of regions of nanostructures is disposed on a device of an electronic package, such as by way of example a microprocessor. Thereafter, the first plurality of regions are contacted with corresponding second plurality of regions of the nanostructures on the substrate, thereby forming a strong friction bond. In another embodiment, the plurality of nanostructures are disposed on a device such as a microprocessor and then contacted with the substrate. Intermolecular forces result in attractive forces between the molecules of the nanostructures and the molecules of the substrate, thereby creating a bond between the nanostructures and the substrate.n n n n Nanostructure interconnection, friction bonding, nanostructures, intermolecular forces |