http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20060044767-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ead90443277482e25bf91bfddef2b5a7 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B05D2202-10 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B05D7-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B05D7-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C28-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B05D3-002 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C26-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C28-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-06 |
| filingDate | 2005-03-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_afe52f0648123cd3f9ee45d49d47122b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fae70f36484b5f59dc539e5e9dcfb9cc |
| publicationDate | 2006-05-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20060044767-A |
| titleOfInvention | Surface treatment method of copper foil and manufacturing method of copper clad laminate |
| abstract | This invention relates to the surface treatment method of the copper foil which can improve the adhesiveness of the surface of copper and resin, and it is related with the copper clad laminated board using the surface treatment copper foil.n n n The manufacturing method of the surface-treated copper foil used for the copper clad laminated board obtained by forming a resin layer on the surface-treated copper foil has organic at least one functional group which has copper foil, and has the function which improves the adhesive force of copper foil and a resin layer. The surface layer of the organic surface treatment agent is partially formed by using a surface treatment step of surface treatment with a treatment liquid (eg, an azole compound) in which the surface treatment agent is dissolved, and an organic solvent (eg, methanol) that can dissolve the organic surface treatment agent. It consists of forming the coating layer of the appropriate thickness processed with the organic surface treating agent on the copper foil by the washing | cleaning process which melt | dissolves and removes.n n n Copper Clad Laminate, Organic Surface Treatment Agent |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100789562-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-116275057-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-116275057-A |
| priorityDate | 2004-03-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 276.