| abstract |
The circuit board of the present invention includes a silver alloy material containing at least one element selected from tin, zinc, lead, bismuth, indium, and gallium as a constituent material of the gate wiring and the gate electrode, and containing silver as a main component. I use it. In particular, it is preferable to use silver as a main component and the silver alloy material containing indium for gate wiring and a gate electrode. Thereby, by adjusting content of indium, the silver alloy material which can adjust suitably resistance value, adhesive force, plasma resistance, a reflection characteristic, etc. can be provided. In addition, it is possible to apply these alloys to the characteristics required for each part of the circuit board.n n n n Circuit board, constituent material, silver alloy material, content, resistance value, adhesion, plasma resistance, reflection characteristic |