| abstract |
Provided are hydride fine particles of copper, nickel or palladium with an average particle diameter of 50 nm or less, which are not easily oxidized in the air and are excellent in storage stability and are suitable for forming metallic materials. Moreover, the dispersion liquid containing the hydride microparticles | fine-particles of copper, nickel, or palladium which is excellent in storage stability is provided, and the metallic material obtained by apply | coating and baking it is provided. The hydride fine particles of copper, nickel or palladium obtained by the present invention and their dispersions can be applied according to various uses. For example, formation and repair of printed wirings using the dispersions, interlayer wiring in semiconductor packages, printed wiring boards And the like for joining of electronic components. |