| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_44ff3005508304394801e265e503b811 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24355 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F1-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F9-7034
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B49-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B49-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F1-60 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B49-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B49-04 |
| filingDate |
2006-03-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a0a81f72ba8c584f14ea5a60599c42e2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c9e423af84a9a6f082ffade7dc1e3687
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e723b4110de0db2604150fcb545e8232 |
| publicationDate |
2006-04-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20060034665-A |
| titleOfInvention |
Method for determining flatness of electronic device substrate, method for manufacturing the substrate, method for manufacturing mask blank, method for manufacturing transfer mask, polishing method, electronic device substrate, mask blank, transfer mask and polishing apparatus |
| abstract |
The flatness of the substrate is determined to achieve the desired flatness of the mask blank by foreseeing a change in flatness resulting from the film stress of the thin film formed on the substrate. The flatness is adjusted by measuring the flatness of the substrate as the measured flatness, selecting the rod type with reference to the measured flatness, and polishing the substrate under the pressure distribution specified by the rod type. The main surface of the substrate has a flatness of more than 0 µm and 0.25 µm or less. The polishing apparatus includes a rotatable surface table, a polishing pad formed thereon, an abrasive supply means for supplying an abrasive to the polishing pad, a substrate holding means, and a substrate pressurizing means for pressurizing the substrate. The substrate pressing means comprise a plurality of pressing means for individually pressing preferably the plurality of divided regions of the substrate surface. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101032932-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101295804-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9293291-B2 |
| priorityDate |
2002-03-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |