abstract |
The present invention relates to maleimide compounds having one or more mono- or polyfunctional groups or vinyl compounds having one or more mono- or polyfunctional groups other than maleimide compounds or combinations of maleimide and vinyl compounds and free radical curing agents, and conditionally A curing composition for sealing an electronic component comprising at least one filler.n n n Maleimide, vinyl, package, sealed |