| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bf735afe8199e200fdbec38aa3a02cd9 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48227
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45139
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-19041
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12041
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01012
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0102
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-486
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01025
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01046 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-642
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-647
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-0753 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-64
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-075 |
| filingDate |
2004-04-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2c14b183322c81d7ee198b1b2dd9a6bf
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a6b1ef1794d0e66a13e9ec02fc96135b |
| publicationDate |
2006-03-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20060026015-A |
| titleOfInvention |
Packaged Light Emitting Diodes for High Temperature Operation |
| abstract |
According to the present invention, a packaged LED for high temperature operation includes a metal base comprising an underlying thermal connection pad and a pair of electrical connection pads, an overlying ceramic layer and an LED die installed over the metal base. The LED is thermally coupled to the thermal connection pads through the metal base, and the electrodes are electrically connected to underlying electrical connection pads. The low thermal resistance insulating layer can electrically insulate other areas of the die from the base while passing heat. Heat flow can be enhanced by thermal vias to the thermal connector pads. Ceramic layers formed on the base support the addition of circuitry to inject the emitted light. The new package can operate at temperatures as high as 250 ° C. |
| priorityDate |
2003-05-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |