| abstract |
The present invention is directed to a method and apparatus for providing cryogenic cooling to HTS devices (24), particularly those used in high voltage power applications. This method pressurizes the liquid coolant 46, 48 above 1 atmosphere to improve its dielectric strength and below the saturation temperature to improve the performance of the HTS component 24 of the apparatus. Subcooling. Apparatus 10 comprising such a cooling method is a cooling system, liquid coolant, which maintains liquid coolant 46, 48 at a temperature below its boiling point to improve the performance of the HTS material 24 used in device 10. Liquid coolant heating unit 52, a supercooled liquid coolant bath, coupled with a gaseous coolant venting scheme 30 to maintain the pressure of the coolant to a value in the range corresponding to the optimum dielectric strength of And a vessel comprising pressurized gaseous coolant region 44. |