| abstract |
New methods for packaging electronic devices (e.g., any device that receives or transmits an electronic signal), including microelectromechanical devices, semiconductor devices, light emitting devices, light modulation devices, and light sensing devices are provided herein. Is provided. The electronic device is located between two substrates, at least one of the substrates having a space for accommodating the electronic device. The two substrates are then bonded and welded closed by a sealing medium. The adhesion of the sealing medium to the substrates can be improved by applying a metallization layer to the surface of the substrate, especially when one of the two substrates is ceramic.n n n n Semiconductor devices, microelectromechanical devices, spatial light modulators, micromirrors, packages |