| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5f7f120efe096284c7389702c969cf3d |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2666-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L33-00 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-385
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J9-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J133-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J133-064
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J151-003 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L33-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J9-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J151-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J151-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J133-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J133-06 |
| filingDate |
2004-05-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_155848afae06bb625bcef7a2cbd27be1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e1450872596286c3b374de493f0691a5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_76801a23960063fa1775076d5367acea
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_681c78076dbd0df2e368d11ab87c49a5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9e311c2f59d6df1e3a90cb1048a3f37a |
| publicationDate |
2006-02-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20060013641-A |
| titleOfInvention |
Thermally conductive pressure-sensitive adhesive composition, thermally conductive sheet-like molded article and method for producing the molded article |
| abstract |
80 to 99.9 wt% of (meth) acrylic acid ester monomer units forming a homopolymer having a glass transition temperature of -20 ° C or less, 0.1 to 20 wt% of monomer units having organic acid groups, and monomer units containing functional groups other than organic acid groups 0 (Meth) acrylic acid ester monomer which forms a homopolymer whose glass transition temperature is -20 degrees C or less in presence of 100 weight part of copolymers which contain -10 weight% and 0-10 weight% of the units copolymerizable with these. (Meth) acrylic acid ester copolymer (A) obtained by superposing | polymerizing 5 to 70 weight part of monomer mixtures which consist of 40 to 100 weight%, the monomer which has an organic acid group, 60 to 0 weight%, and the monomer copolymerizable with these 0 to 20 weight%, (A) The heat conductive pressure sensitive adhesive composition which consists of 70-170 weight part of heat conductive inorganic compounds (B) with respect to 100 weight part. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20170013075-A |
| priorityDate |
2003-05-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |