| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_3a62c92e56568bd104089aac22ca487b |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-7684
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76877
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2885 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 |
| filingDate |
2003-12-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_635662850f07e71769f192d6e1359081
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9b3ca238ee4179e4aa811f70201fe547
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_53b6c38a570a26e12eba7e606d9d2ef1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ab5f32d6f9d4320e134227e299fd920b |
| publicationDate |
2006-01-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20060008946-A |
| titleOfInvention |
Copper electroplating method for patterned dielectric layers to improve process uniformity for subsequent CPM processes |
| abstract |
In a new metal plating method onto a dielectric layer comprising small diameter vias and large diameter trenches 205, the surface roughness is, for example, of the leveler in the plating solution on at least the unpatterned region 206 of the dielectric layer 203. It is produced by reducing the amount, thereby improving the uniformity of material removal in subsequent chemical mechanical polishing (CMP) processes. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100761360-B1 |
| priorityDate |
2003-04-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |