http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20060007961-A

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ae372ddaa494f2face39592b0429cc16
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-00
filingDate 2004-07-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2e182fc6401934d0698d76fa743710aa
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fb3a7b1f43f08b6d4c3a9205cf81417a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_27bbb9cd93550a4eb34e09514bd2f14f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cb8943f40f775d991487279e8a59043b
publicationDate 2006-01-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20060007961-A
titleOfInvention Flip chip type nitride light emitting device and its manufacturing method
abstract BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flip chip nitride light emitting device and a method of manufacturing the same. In the flip chip nitride light emitting device, an n-type cladding layer, an active layer, and a p-type cladding layer are sequentially stacked on a substrate, and are modified on a p-type cladding layer. A multi-ohmic contact layer and a reflective layer formed of a reflective material on the multi-ohmic contact layer having at least one or more layers repeatedly stacked by using a metal layer and at least one transparent conductive thin film layer as a repeating repeating unit, and the modified metal layer mainly includes tin and tin. Thus, the additive element is formed of either an added alloy or a solid solution. According to the flip chip type nitride-based light emitting device and a method of manufacturing the same, the ohmic contact property with the p-type cladding layer is improved to increase the wire bonding efficiency and the yield when packaging the light emitting device, and the low specific contact resistance and the high electrical and light emission Provide efficiency.
priorityDate 2004-07-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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