abstract |
The present invention relates to an ultra low dielectric film for copper wiring using a monosaccharide derivative. More particularly, the ultra low dielectric composition containing a monosaccharide derivative having an alkoxysilane end group as a pore-forming template is prepared by curing and high temperature heat treatment. In one embodiment, the present invention relates to an ultra low dielectric film having a low dielectric constant, excellent mechanical strength, and containing very small nanopores of 2 nm or less. |