| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_cf213be03285a0b93967ae2fd2fd351a |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J2211-225 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J9-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J11-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F2-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-16 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-033
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-028
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01J11-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01J11-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C03C8-18 |
| filingDate |
2004-06-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a77a49a1f808c2945b852cc1b15ec61e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7c85e80eae5be7291dd9ebf2d9dee9b9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e575f8584187ba0b340d0ac7550be077
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0445bedfe76c61b2d8ef0857553ba25e |
| publicationDate |
2005-12-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20050114408-A |
| titleOfInvention |
Pb free ag paste composition for pdp address electrode |
| abstract |
The present invention, a) 60 to 90% by weight of Ag powder; b) 1 to 10% by weight of an inorganic binder free of Pb; c) 0.001 to 1 weight percent of an inorganic thickener; And d) 5 to 38% by weight of an alkali-soluble negative photoresist composition for dispersing fine conductive powder. The Pb-free Ag paste composition according to the present invention is iii) environmentally friendly using an inorganic binder that does not contain Pb, and ii) is suitable for producing finer electrodes using the conventional electrode forming process as it is, iii) The formed pattern can be applied to a low firing process of 600 ° C. or less, i) excellent printability, leveling property and sinterability using inorganic thickener and conductive Ag powder without the use of surfactants and stabilizers; Sintering may proceed at a sintering target temperature without a binder burning off zone. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2009157727-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2009157727-A2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100906501-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2007119955-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100978736-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100839046-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20160128203-A |
| priorityDate |
2004-06-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |