| abstract |
The present invention relates to a thermally conductive silicone composition comprising an organopolysiloxane (A), a thermally conductive filler (B) and at least two organopolysiloxanes (C) of formula (I) having different n values except for the following component (C).n n n Formula 1n n n n n n n n In Formula 1 above,n n n R 1 is independently selected from monovalent hydrocarbon group,n n n R 2 is an oxygen atom or a divalent hydrocarbon group,n n n R 3 is alkyl, alkoxyalkyl, alkenyl or acyl,n n n n is an integer from 5 to 100,n n n a is an integer of 1-3. |