| abstract |
The present invention relates to a composition comprising: a) an admixture of at least one epoxy resin with an aliphatic amine having an epoxy functional group / amine ratio of greater than 1, b) a conductive filler, c) a corrosion inhibitor and an oxygen trapping agent, d ) An imidazole as a curing agent / curing reaction catalyst, and optionally e) organic solvents, flow additives, adhesion promoters, and other additives such as rheology modifiers. In the present invention, the prepolymer of an epoxy resin having an excess of epoxy functional groups and an aliphatic amine is obtained to obtain a prepolymer having a flexible structure and containing a residual epoxy group having activity. The composition of this invention is excellent in electrical stability and impact resistance compared with the conventional conductive adhesive composition which does not contain the said addition mixture. |