http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20050100592-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d68514a32e3a53b7a0c77aabb87304b8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_cba7bf4aa23fd3cfc88f6b9e60ef93f8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8196ed0974ab55a6949f9acaf2d6319b |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C99-009 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-3218 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-038 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0017 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81C1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-038 |
| filingDate | 2003-08-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1267b7140c4134b6b94768614cb7c548 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_93d6a55f9d257bc9d19b043b42b99b88 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f8a8d4073fdea910ebfa0a837d1635aa http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8ecf121581384c030cb5baf82d9a73f8 |
| publicationDate | 2005-10-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20050100592-A |
| titleOfInvention | Method for producing a pattern formation mold |
| abstract | The method for producing a pattern forming mold of the present invention is a method of applying a radiation-sensitive negative type resist composition containing an epoxy resin represented by the following formula (1) to a substrate together with a radiation-sensitive cationic polymerization initiator and a solvent for dissolving the epoxy resin Stage 1; Drying the substrate coated with the radiation sensitive negative resist composition to form a resist film; Selectively exposing the formed resist film to an active energy beam according to a predetermined pattern; Heating the exposed resist film to increase the contrast of the pattern to be formed; A fifth step of developing the heated resist film to remove the unexposed portions of the resist film through dissolution to form a patterned layer; And applying a material other than the material of the patterned layer to the patterned layer to fill a space present in the patterned layer with the material at least in part to form a second layer, and removing the second layer. And a sixth step of obtaining a pattern forming mold:n n n n Formula 1n n n n n n n n n Wherein R 1 represents a moiety derived from an organic compound having k active hydrogen atoms, k represents an integer from 1 to 100; Each n 1 , n 2 to n k is 0 or an integer from 1 to 100; the sum of n 1 , n 2 to n k is in the range of 1 to 100; Each "A" may be the same or different from each other and represents an oxycyclohexane skeleton represented by the following general formula (2):n n n n Formula 2n n n n n n n n n Wherein X represents any group represented by the following formulas (3) to (5):n n n n Formula 3n n n n n n n n n n Formula 4n n n n n n n n n n Formula 5n n n n n n n n n In the above formula, R 2 represents a hydrogen atom, an alkyl group or an acyl group, and two or more groups represented by the formula (3) are contained in one molecule of the epoxy resin. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100782412-B1 |
| priorityDate | 2002-08-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 78.