| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_62fdba7df52864f2aeb98ddce78d9a12 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31725
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31721 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-094
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-095
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F-
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-037
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-095
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-00 |
| filingDate |
2003-12-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ad8c77dd8cf909201119a70b06cc9bc9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ea33e86525b840c35439e9b85dfe2299
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3d05720a81e850e02bdc647384be29ef
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b5e551617307a3fbf4a6548ab0aed5b3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8e51e847932edf960192f7ffa2c901fe |
| publicationDate |
2005-09-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20050089819-A |
| titleOfInvention |
Process for producing a heat resistant relief structure |
| abstract |
A method of making heat resistant relief structures on a substrate, the method comprising: (a) providing a substrate; (b) a first coating step of coating the substrate with a composition comprising polyamic acid and gamma -butyrolactone to form a polyamic acid layer having a thickness of at least about 0.5 μm; (c) baking the polyamic acid layer at a temperature or temperatures lower than 140 ° C .; (d) a second coating step of coating the photoresist layer on the polyamic acid layer to form a bilayer coating; (e) exposing the bilayer coating to radiation of less than 250 nm; (f) developing the bilayer coating with one or more aqueous tetramethyl ammonium hydroxide solutions; (g) removing the residual photoresist layer; And (h) curing the polyamic acid layer at a temperature that is at least about 200 ° C. to produce a polyimide structure in which the polyamic acid is soluble in aqueous tetramethyl ammonium and insoluble in the solvent used with the photoresist. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100911076-B1 |
| priorityDate |
2002-12-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |