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filingDate 2005-08-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5ba6aeefc3dd49379327e32143c8ce12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_15bda86b806c9d43497a69a0ab754fb4
publicationDate 2005-09-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20050089783-A
titleOfInvention Manufacturing method of electrolytic copper plating materials
abstract An object of the present invention is to provide an electrolytic copper plating material having high solubility and capable of suppressing generation of insoluble residue, or providing an electrolytic copper plating material having few impurities. The present invention provides a method for producing an electrolytic copper plating material which is supplied as a copper ion replenisher to a copper plating bath when the plated body is subjected to electrolytic copper plating, wherein the basic copper carbonate is reduced to 250 ° C to 800 ° C under an atmosphere that does not become a reducing atmosphere. The electrolytic copper plating material which consists of copper oxide which is easy to melt | dissolve by heating and thermally decomposing is obtained.
priorityDate 2000-09-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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