http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20050089243-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_33c922e05f6133b7d72dbb849d77487d |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0154 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0355 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0393 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0346 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-08 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 |
| filingDate | 2004-03-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7a8e086ba024c0bee86629e3f31621a3 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_abcf919bba706b5db854c6e6099ce938 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b9df0bb15b5de2793fe7a1cca8cd425d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f8095959a105a16826e81933f41253fc http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_639b2541c294653fc60ed053c8db5b6c |
| publicationDate | 2005-09-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20050089243-A |
| titleOfInvention | Flexible printed board and the manufacturing method thereof |
| abstract | The present invention relates to a flexible circuit board and a method for manufacturing the same, more specifically copper foil; A first polyimide resin layer positioned on one surface of the copper foil and having a linear expansion coefficient of 10 × 10 −6 to 17 × 10 −6 / K; And a second polyimide composed of the same component as the first polyimide resin layer, positioned on one surface of the first polyimide resin layer, and having a linear expansion coefficient of 17 × 10 −6 / K to 20 × 10 −6 / K. The present invention relates to a flexible circuit board including a mid resin layer and a method of manufacturing the same.n n n The flexible circuit board of the present invention is formed of two kinds of polyimide layers having different linear expansion coefficients by using one kind of polyamic acid varnish, which has excellent reliability in dimensional stability, planarity after etching, etc., and excellent workability in circuit formation. In particular, as one kind of polyamic acid varnish, it is possible to manufacture a flexible circuit board having a polyimide resin layer having a two-layer structure having a different linear expansion coefficient, thereby reducing the effort of varnish manufacturing. . |
| priorityDate | 2004-03-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 59.