| abstract |
The present invention relates to an epoxy resin composition containing an epoxy resin (a) and a phenolic hydroxyl group-containing polyamide resin (b) having a structure represented by formula (1), a curing method of the composition, a varnish using the composition, a prepreg And an epoxy resin hardener containing the polyamide resin represented by Formula (1) as an active ingredient.n n n The cured product of the epoxy resin composition of the present invention has sufficient flexibility even when molded into a thin film, and has flame retardancy even though it does not contain a flame retardant such as a halogen-based flame retardant or an antimony compound, and thus has excellent heat resistance and adhesion, It is very useful for a wide range of applications such as molding materials, mold materials, laminated materials, paints, adhesives, and resists. |