abstract |
The present invention relates in particular to curable underfill encapsulant compositions useful for non-flowable underfill encapsulation processes. Compositions of the present invention include epoxy resins, linear polyanhydrides, core-shell polymers, and catalysts. In another embodiment, the composition further comprises a cyclic anhydride. Also, in some cases, various additives such as surfactants and coupling agents may be further added to the composition. |