patent/KR-20050084312-A

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20050084312-A

Outgoing Links

Predicate	Object
assignee	http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_069a92549123806a5d654dc036a676e9
classificationCPCAdditional	http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01322 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-056 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3463 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01006 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01005 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01022 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01092 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01019 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01018 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01015 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01013 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01029 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11462 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01023 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-05 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01047 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13099 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01033 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01039 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01082 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05573 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01078 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01076 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3436 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05568 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01074 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-014
classificationCPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4853 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D21-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2885 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-505 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49816
classificationIPCAdditional	http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34
classificationIPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-485 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-498 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D21-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-60
filingDate	2003-12-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8fedb24e259e791ec5fb0a661ab4ca1c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_128628b8e98d2e0f38a1327ab13f2485 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_851e2c94a4083c0d3e8ee96cb2497fb9 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8db43a00fee50cbf9d5eb87cd286fb55 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7a8a6c72f2e475180b3674086c0dd26b
publicationDate	2005-08-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	KR-20050084312-A
titleOfInvention	Lead-free bump and method for forming the same
abstract	The present invention relates to a lead-free bump in which generation of voids obtained by reflowing a Sn-Ag-based solder alloy plated film in which Ag concentration in a plated film is adjusted is suppressed and a method of forming the same. The lead-free bump of the present invention is obtained by forming an Ag-containing Sn-Ag based alloy film having a lower Ag-Ag eutectic concentration by plating and reflowing the alloy plating film.
priorityDate	2002-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate	Subject
isDiscussedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID104727 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23960 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419577459 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419583196

Total number of triples: 64.