http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20050080299-A

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f6f175f2c8eac40363953838045e7c40
classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01S2304-04
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01S5-3202
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01S5-0264
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-145
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01S5-026
filingDate 2004-02-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_80c7170103fc6baa69e88cea25da8525
publicationDate 2005-08-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20050080299-A
titleOfInvention Semiconductor laser diode and method for manufacturing the same
abstract BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor laser diode and a method of manufacturing the same, wherein the bandgap of the active layer region corresponding to the lower part of the optical waveguide is made smaller than the bandgap of the active layer region except for the region, so that the current range capable of oscillating in a single mode In addition, the present invention provides a first process of sequentially forming an n-clad layer, an active layer, a first p-clad layer, an etch stop layer, and a second p-clad layer on a substrate. ; Forming a ridge by etching a portion of the second p-clad layer according to a predetermined mask pattern; A third process of forming a predetermined dielectric film on an upper portion including the etch stop layer formed in the first process and the ridge formed in the second process; A fourth step of intermixing the dielectric film formed in the third step and the remaining areas of the active layer except for the area corresponding to the lower portion of the ridge and removing the dielectric film; A fifth process of forming a current blocking layer in the remaining region where the dielectric film is removed in the fourth process, except for a region corresponding to an upper portion of the ridge formed in the second process; A semiconductor laser diode fabricated through a sixth process of forming a p-pad layer in a region including the ridge formed in the second process and the upper portion of the current blocking layer formed in the fifth process is disclosed.
priorityDate 2004-02-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
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http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID457707758
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID24261
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID3084099

Total number of triples: 18.