| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7ef01e33058cf740cf2197991be97af1 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-6834
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68327 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6835
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-302
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G06K19-077
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-68
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-44 |
| filingDate |
2005-01-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_100f14675d011809766adc6aa8b575f5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8ed1101e517de52e2c85d458a66f0999
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_964737f13740839d65e919a6dea01bd8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4f35248d1ec07a7cb28a595066a56ec9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ff59fb29a904adcee8eb1e3a822272b4 |
| publicationDate |
2005-08-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20050077476-A |
| titleOfInvention |
Method of protecting semiconductor wafer, and adhesive film for protection of semiconductor wafer |
| abstract |
The present invention provides a method of protecting a semiconductor wafer that can prevent warpage during wafer transfer by correcting warpage of the semiconductor wafer even when the semiconductor wafer is thinned to a thickness of 150 µm or less.n n n The present invention provides a first step of adhering a semiconductor wafer protective pressure-sensitive adhesive film having an adhesive layer formed on one surface of a base film on a circuit forming surface of a semiconductor wafer, and a second process of heating a semiconductor wafer to which the pressure-sensitive adhesive film for semiconductor wafer protection is bonded. And a third step of processing the semiconductor wafer circuit non-forming surface by fixing the semiconductor wafer to which the semiconductor wafer protective pressure-sensitive adhesive film is adhered to a grinding machine or a polishing machine, and a fourth process of peeling off the semiconductor wafer protection pressure-sensitive adhesive film from the semiconductor wafer. Provided are a semiconductor wafer protection method in a semiconductor wafer processing step. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7521384-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100845986-B1 |
| priorityDate |
2004-01-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |