| abstract |
According to the present invention, the electrode member 42 and the circuit member 30 are formed on the surface 31a of the substrate 31 adjacent to each other, and the circuit member 30 is formed on the surface 41a of the substrate 41. As the circuit member 40 in which the insulating layer 43 is formed adjacent, the edge portions 33a and 43a of the insulating layers 33 and 43 are thicker than the electrodes 32 and 42 with respect to the main surfaces 31a and 41a. As a circuit connecting material for connecting the formed circuit members 30 and 40, the adhesive composition 51 and the electrically-conductive particle 12 whose average particle diameter is 1 micrometer or more and less than 10 micrometers, and whose hardness is 1.961-6.865 GPa are used. In addition, by hardening treatment, the storage modulus in 40 degreeC will be 0.5-3 GPa, and the average coefficent of thermal expansion from 25 degreeC to 100 degreeC will be 30-200 ppm / degreeC. |