| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d3082cd39bb800686b9abbb8aa05c80b |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3212
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-312 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09G1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-321
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14 |
| filingDate |
2003-09-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0067c2f4d7d9ea1cd7fd4358bb57889a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_60bc2ca40f74d190fd770267a4cf85b2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0a557a7b9b82b99654057878b9da4d79
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b2cef20f850b37b4605c6c73e5f74a4d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_10061144ae84c9e385b66cfc4fda1a5d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_128753686ca9827c5bf93a29a5dbcba8 |
| publicationDate |
2005-07-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20050070048-A |
| titleOfInvention |
Apparatus and method for replacing a media content item |
| abstract |
The invention relates to a substrate comprising the steps of (i) contacting a substrate comprising at least one metal layer comprising copper with a chemical-mechanical polishing (CMP) system and (ii) polishing at least a portion of the metal layer comprising copper to polish the substrate. Provide a polishing method. The CMP system comprises (a) an abrasive, (b) an amphiphilic nonionic surfactant, (c) a means for oxidizing the metal layer, (d) an organic acid, (e) a corrosion inhibitor, and (f) a liquid carrier. The present invention further provides a two-step polishing method of a substrate comprising a first metal layer and a different second metal layer. The first metal layer is polished with a first CMP system comprising an abrasive and a liquid carrier and the second metal layer is polished with a second CMP system comprising (a) an abrasive, (b) an amphipathic nonionic surfactant, and (c) a liquid carrier. do. |
| priorityDate |
2002-10-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |