| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_73b09fc2f9159cc9a7d5832a867d5877 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76874
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-16 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-42 |
| filingDate |
2003-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_46b65c57707c3c470d5c4bdbd1b59964
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_05f9d8791e79443d5ee6bc7b2bcc7bdf
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7161bc8d129845ce15c892c653e857ca
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f0363ad3c68d9cb79defdf7b28321aa3 |
| publicationDate |
2005-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20050067181-A |
| titleOfInvention |
Substitution type electroless gold plating bath |
| abstract |
Disclosed is a substituted electroless gold plating solution which prevents oxidation of the surface of a metal to be plated without using a reducing agent and forms a gold film having good solder bonding properties.n n n Substituted electroless gold plating solution containing a water-soluble gold salt, a conductivity enhancer, a chelating agent having an imino diacetic acid structure, a surface oxidation inhibitor composed of an organic compound containing two or more nitrogen atoms in the main chain or ring, and a solvent as a residual amount . |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11671229-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11070344-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101857596-B1 |
| priorityDate |
2002-10-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |