http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20050060485-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c16d2144a81bfa32a665dca1e93c3d37 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-68721 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-562 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02 |
| filingDate | 2003-12-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8ec7de15089896c0588abeae5a1de160 |
| publicationDate | 2005-06-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20050060485-A |
| titleOfInvention | Wafer covering system for semiconductor processing equipment |
| abstract | The wafer covering system for semiconductor manufacturing equipment includes an annular covering formed of aluminum and having an anodized protective film and a protective film of ceramic material in close contact with the outer peripheral portion of the wafer to be etched; A driving device for raising and lowering the covering; And a driving pin connecting the covering and the driving device. Here, it is preferable that the outer surface of the covering forms a to-be-protected film, and the outer surface of the covering is formed of a ceramic protective film. |
| priorityDate | 2003-12-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 18.