| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8e43b4ca6b41ce9f54c9a895d474c81a |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L31-0216
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L31-0203
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L61-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-621
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-62 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L31-0203
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L31-0216
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L61-00 |
| filingDate |
2003-10-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_23a1e93250a90dfd642f43f88b205db7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_946f5ff45d52d73074fd6c0d121cd2ea |
| publicationDate |
2005-06-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20050059224-A |
| titleOfInvention |
Epoxy resin composition for sealing optical semiconductor |
| abstract |
This invention is a bisphenol-type novolak resin represented by (A) Formula (1), The bisphenol-type novolak resin whose total content rate of the low molecular weight whose n = 0, 1 or 2 is 10 weight% or more with respect to the whole resin. And (B) a terpene-containing polyhydric phenol curing agent obtained by adding two molecules of phenols to one molecule of a cyclic terpene compound, (C) a curing accelerator, (D) an epoxy resin other than the component (A) and a novolak resin as a curing agent. The present invention relates to an epoxy resin composition for sealing optical semiconductors containing at least one resin selected from the group, and to an optical semiconductor element sealed with a cured product of the composition, the composition having excellent workability and excellent productivity of a sealing optical semiconductor. Moreover, the optical semiconductor sealed with the hardened | cured material of this composition is excellent also in the solder reflow resistance after moisture absorption and heat resistance with respect to HC. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9594206-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101524898-B1 |
| priorityDate |
2002-10-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |