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publicationDate 2005-06-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20050057164-A
titleOfInvention Controlled depth etched dielectric film
abstract The dielectric film used as the substrate for the flexible circuit includes a polymer selected from the group consisting of a liquid crystal polymer and a polyimide copolymer comprising a carboxyl ester structural unit in the polymer backbone. The dielectric film includes at least one thinned recess area having a thickness reduced to less than 15 μm, requiring the use of dielectric film, for example, for ink jet printheads, hard disk drive gimbal devices, and contact sensor applications. It has a thickness of 탆 to 60 탆.
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