http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20050054011-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c16d2144a81bfa32a665dca1e93c3d37 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48247 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-0657 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49524 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 |
| filingDate | 2003-12-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_227b88d759f70b8225ea6fec2323008d |
| publicationDate | 2005-06-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20050054011-A |
| titleOfInvention | Multi-type semiconductor chip package |
| abstract | The present invention relates to a multi-type semiconductor chip package incorporating two or more of the same semiconductor chip, and more particularly, to a plurality of bonding pads and long sides facing each other formed in rows at edges facing each other on the active surface. Semiconductor chips having redistribution bonding pads formed in rows at edges, die pads on which upper and lower sides of semiconductor chips are attached adjacent to each other in a horizontal direction, and inner leads spaced apart from the die pad by a predetermined distance Bonding wires electrically connected between the redistribution bonding pads adjacent to each other between the semiconductor chips attached in a horizontal direction and between the redistribution bonding pads adjacent to the inner leads and the corresponding inner leads; Package body and inner ring for sealing die pad and the inner leads and bonding wires By forming the same plurality of semiconductor chips having a redistribution structure vertically or horizontally, including the outer leads protruding out of the package body and integrally formed with the substrate, the electrical characteristics are improved, and the thickness and density of the package body are greatly improved. The effect can be obtained. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100826976-B1 |
| priorityDate | 2003-12-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 18.