abstract |
The present invention relates to silica on a semiconductor wafer, comprising 0.001 to 1% by weight of phthalic acid and salts thereof, 0.001 to 1% by weight of quaternary ammonium compounds, 0.01 to 5% by weight of carboxylic acid polymers, 0.01 to 5% by weight of abrasive and residual amounts of water and Provided are aqueous compositions useful for polishing silicon nitride. |