| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4414d40ccb24e90d601a1253cc7b700c |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-001 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6708
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2885
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25F7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23H3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-306
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6838
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-68707 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-687
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-683
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25F7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3205
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23H3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25F3-30 |
| filingDate |
2002-11-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a5cb2d261e88838a3f3c54b587253845
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c3e5c54367e643c324cb52d9fe3a101d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8af2e5fd981887deaf2ba884d52e45e6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ffe63aeb4e83191d08a64aef9c737628
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_42195aadcd10e155aef5835923274191 |
| publicationDate |
2005-05-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20050044404-A |
| titleOfInvention |
Electropolishing assembly and methods for electropolishing conductive layers |
| abstract |
In one aspect of the invention, an exemplary apparatus and method for electropolishing a conductor film on a wafer 1004 is disclosed. The apparatus includes a wafer chuck 1002 for holding a wafer, an actuator 1000 for rotating the wafer chuck, and a nozzle 1010 configured to electropolize the wafer. The device may also include a conductor ring or shroud 1006. The method of electropolishing the conductor film on the wafer includes rotating the wafer chuck at a rate sufficient to allow electrolyte fluid incident on the wafer to flow to the surface of the wafer towards the edge of the wafer. |
| priorityDate |
2001-11-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |