| abstract |
(Problem) Provided are a ceramic substrate for thin-film electronic components, a method of manufacturing the same, and a thin-film electronic component using the same.n n n (Solution means) The first substrate includes a base ceramic substrate 2, and the base ceramic substrate 2 includes a dense glass ceramic mixed layer 33 containing glass on its surface. The 2nd board | substrate heat-pressurizes the glass layer 32 formed in the surface of the base ceramic substrate 2, and glass is spread | diffused in the surface part of this base ceramic substrate 2, The dense glass ceramic mixed layer ( 33), and the dense glass ceramic mixed layer 33 is exposed by planarization polishing. The third substrate includes a base ceramic substrate 2 having a dense glass ceramic mixed layer 33 containing glass on one surface side thereof, and a wiring pattern 21 formed inside the base ceramic substrate 2. And one end of the wiring pattern 21 is exposed to the surface of the dense glass ceramic mixed layer 33 in the surface of the ceramic substrate 1 for thin film electronic parts, and the other end is viewed. It is exposed to the other surface of (1). |