patent/KR-20050031963-A

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20050031963-A

Outgoing Links

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classificationIPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-68 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-498 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12
filingDate	2004-09-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_858b48a81e541c5d8342083fecc23435 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_09fb382944bc463c53d49196cbfc7c67 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9e3c1dab5d06056b9c48e9e391df088d
publicationDate	2005-04-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	KR-20050031963-A
titleOfInvention	Semiconductor device containing stacked semiconductor chips and manufacturing method thereof
abstract	An adhesion film is formed on the electrode film surface, and a coating film is formed thereon. Nickel, chromium, molybdenum, tungsten, aluminum, these alloys, etc. are used as a constituent material of an adhesion film. Gold, silver, platinum, these alloys, etc. are used as a constituent material of a coating film.
priorityDate	2003-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate	Subject
isDiscussedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID83648 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID415777387

Total number of triples: 61.